BD86852MUF-C
PMIC for Automotive Camera
BD86852MUF-C
PMIC for Automotive Camera
BD86852MUF-C is a power management IC with primary buck converter (DC/DC1), secondary buck converters (DC/DC2 and DC/DC3), external linear regulator control block and the power-on reset function for CMOS sensor and image sensing power supply. Output voltage and sequence are selectable and applicable to various image sensor power supply. This device adopts small package VQFN24FV4040 which is optimal for camera module. In addition, this device has a pin that can be programmed to turn on/off the spread spectrum providing a lower noise regulated outputs.
主要规格
功能安全:
特性：
ch
3
Vin1(Min.)[V]
4
Vin1(Max.)[V]
18
Output Voltage1 (Min.)[V]
3.3
Output Voltage1 (Max.)[V]
3.9
Output Current Capacity 1 [A]
2
Output Voltage2 (Min.)[V]
1.1
Output Voltage2 (Max.)[V]
1.2
Output Current Capacity 2 [A]
1
SW frequency(Max.)[MHz]
2.2
Circuit Current(Typ.)[mA]
3
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
125
Package Size [mm]
4x4 (t=1)
Common Standard
AEC-Q100 (Automotive Grade)
特点：
- AEC-Q100 Qualified (Grade 1)
- Output Voltage:
VO1: 3.3V or 3.9V (±2%)
VO2: 1.1V or 1.2V (±2%)
VO3: 1.8V (±2%) - Output Current:
VO1: 2A (Max)
VO2: 1A (Max)
VO3: 1A (Max) - Functional Safety Supportive Automotive Products
- Primary DC/DC (VO1)
DC/DC with built-in FET
High Efficiency with Synchronous Rectification - Dual Secondary DC/DC (VO2, VO3)
DC/DC with built-in FET
High Efficiency with Synchronous Rectification - Each Protection Function
- Spread Spectrum for EMC
- Fail Detection Pin (for each output)
- Selectable Output Voltage and Sequence
Reference Design / Application Evaluation Kit
-
- Evaluation Board - BD86852-TSB-001
BD86852-TSB-001 is an evaluation board for Power Management IC BD86852MUF-C that is suitable for Camera module application such as ADAS camera sensor. BD86852MUF-C integrate primary buck converter (DC/DC1), secondary buck converters (DC/DC2 and DC/DC3). Together with on board linear regulator, all power rails required for CMOS image sensor and image processor are available. The PCB layout has been miniaturized and optimized for use in camera modules.
