ROHM Product Detail

BSM120D12P2C005
SiC(碳化硅)功率模块

使用罗姆公司生产SiC元件的半桥构成全SiC功率模块。

Data Sheet 购买 *
* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | BSM120D12P2C005
Status | 推荐品
封装 | C
包装形态 | Corrugated Cardboard
包装数量 | 12
最小独立包装数量 | 12
RoHS | Yes

特性:

Drain-source Voltage[V]

1200

Drain Current[A]

134

Total Power Dissipation[W]

935

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

125

Package

Half bridge

Package Size [mm]

122x45.6 (t=17.5)

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特点:

・Full SiC power module with SiC MOSFET and SiC SBD
・High-speed switching and low switching loss
・Ensured reliability of body diode conduction

Reference Design / Application Evaluation Kit

 
    • Drive Board - BSMGD3C12D24-EVK001
    • This evaluation board, BSMGD3C12D24-EVK001, is a gate driver board for full SiC Modules in C type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide
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