ROHM Product Detail

BSM400D12P2G003
SiC(碳化硅)功率模块

BSM400D12P2G003是由SiC-DMOSFET和SiC-SBD构成的半桥功率模块。适合电机驱动、逆变器、转换器、光发电、风力发电及IH装置等用途。

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* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | BSM400D12P2G003
Status | 推荐品
封装 | G
包装形态 | Corrugated Cardboard
包装数量 | 4
最小独立包装数量 | 4
RoHS | Yes

特性:

Drain-source Voltage[V]

1200

Drain Current[A]

397

Total Power Dissipation[W]

2450

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

125

Package

Half bridge

Package Size [mm]

152x62 (t=18)

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特点:

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

Reference Design / Application Evaluation Kit

 
    • Drive Board - BSMGD2G12D24-EVK001
    • This evaluation board, BSMGD2G12D24-EVK001, is a gate driver board for full SiC Modules with the 2nd Generation SiC-MOSFET in G and E type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module

  • User's Guide
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