ML22660GD(Taping)
AB类功放/D类功放内置型
ML22660GD(Taping)
AB类功放/D类功放内置型
ML22620/ML22660可以在外部连接高达128Mbit的串行存储器，因此是非常适合长时间语音播放应用的语音合成LSI。
产品采用实现高音质的HQ-ADPCM、16位D/A转换器和低通滤波器，并内置用来直接驱动扬声器的1.0W单声道扬声器放大器。
语音输出所需的功能已经全部集成于1枚芯片中，因此仅需增加本LSI，即可轻松实现语音功能。
主要规格
特性：
Operating Voltage [V]
2.7 to 3.6 or 3.3 to 5.5
Operating Frequency [MHz]
4.096
4.000
Oscillator
Built-in
External
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
85
ROM Capacity [bit]
External maximum 128M
Number of Phrases
4096
Maximum Playback Time ?
109min *1
CPU I/F
I2C
SP Amplifier Output [W] / Class
1.0/AB-class,
D-class
Number of Mixing (Internal) [ch]
4
Others
Failure detection
Automotive Grade
No
AEC-Q100 standard
No
Industrial Grade
Yes
Development Support
-
- Reference Board
- RB-S22660GD32
- Supply Status
- Recommended
- Supporuted LSI
- ML22660 (WQFN32 package)
- Composition
- Reference board with WQFN32 socket and external flash memory
- User's Manual
- Notes
- Used by connecting to SDCB3.
- Reference board for WQFN32 package.
-
- Reference Board
- RB-S22660TB32
- Supply Status
- Recommended
- Supporuted LSI
- ML22660 (TQFP32 package)
- Composition
- Reference board with TQFP32 socket and external flash memory
- User's Manual
- Notes
- Used by connecting to SDCB3.
- Reference board for TQFP32 package.
-
- Development Kit
- SDCK3
- Supply Status
- Recommended
- Supporuted LSI
- ML22530, Q532, Q533, Q535
- ML22620, Q623, Q624, Q625, Q626
- ML22660, Q663, Q664, Q665, Q666
- ML22Q234, Q244, Q254
- ML22Q274, Q284, Q294
- ML22572, 573, Q573, Q553, ML22594
- ML22Q374, Q394
- ML22562, 563, Q563
- ML22823, 824, 825
- ML22863, 864, 865
- Composition
- Sound device control board 3 [SDCB3]
- USB cable
LAPIS TECHNOLOGY™ 是ROHM Co., Ltd.的商标或注册商标。