ML7345DGD
Sub-GHz LSI
ML7345DGD
Sub-GHz LSI
ML7345D是支持315MHz～960MHz频段的低功耗Sub-GHz窄带无线LSI，全球适用。
ML7345系列内置有支持12.5kHz以上信道间隔的可编程信道选择滤波器。
ML7345系列与ML7344/ML7406系列在封装、引脚排列和主要寄存器方面规格相同，因此在日本国内外的窄频和宽频Sub-GHz应用中可实现电路板和软件通用。
主要规格
特性：
Support Standard
ARIB STD-T67,ARIB STD-T108,RCR STD-30,EN300-220,EN13757-4:2013,IEEE802.15.4g
Frequency Band [MHz]
400, 860, 920
(315-960)
Tx Power [dBm]
1/10/13
Max. Data Rate [kbps]
100
Modulation Method ?
2-FSK
4-FSK
RF Function
Antenna Diversity
Communication Mode
Packet (SPI),
DIO
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
85
Development Support
-
- Reference Board
- ML7345DEVB
- Supply Status
- Recommended
- Support Standard
- ARIB STD-T108 (920MHz)
- EN300-220
- EN13757-4 Wireless M-Bus
- Host I/F
- Synchronous serial
- Components
- Evaluation Board
- Control Board
- Tools(CD-ROM)
- USB cable
- Notes
Evaluation kit for evaluating RF performance
ML7345D evaluation kit is available to evaluate TX/RX performance. This kit includes RF board, Control board and Tool CD-ROM.
The enclosed GUI interactive software enables to setup ML7345D easily. Enclosed RF test macro enables to confirm TELEC test item immediately.
LAPIS TECHNOLOGY™ 是ROHM Co., Ltd.的商标或注册商标。